A flurry of news on Monday, suggests some pretty exciting and wild updates could be on the way in the Autumn. From HomePod updates to new chip designs and more, there is a lot to unpack.
Resurrecting the HomePod ‘Biggie’
As reported by Mark Gurman in the latest edition of Power On, Apple is planning to bring back the full-size HomePod in the near future. While it won’t be identical, it’s likely to have a similar size and form factor and offer comparable sound quality. As with its smaller sibling, the HomePod mini, the device is thought to use an Apple Watch chip. In this case, a yet-to-be-announced ‘S8’ chip.
The HomePod, code-named B620, will run the same S8 chip coming to the watches and will be closer to the original HomePod in terms of size and audio performance rather than a new HomePod mini. The new HomePod will have an updated display on top and there’s even been some talk of multi-touch functionality.Mark Gurman
The AppleTLDR take
The HomePod was an incredible sound experience. But it came to market too late and at the wrong price point. Now that more people have experienced and warmed to the HomePod range thanks to the affordable HomePod mini, it could be the perfect time for a HomePod revival. The beam-forming, adaptive audio experience of the OG HomePod was on another level. Not that the mini is a bad experience. But it can’t deliver the range, depth and clarity of the full-size HomePod.
M2 Pro to be based on 3nm tech
Digitimes and Mark Gurman both expect the M2 Pro chip to be based on TSMC’s 3nm technology. It’s also likely that the M2 Max (itself a larger die variant of the Pro line of Apple Silicon) will be based on 3nm if this reporting is accurate. This would be an unusual deviation from the precedent set by the M1 line given that M2 in the new MacBook Air remains a 5nm chip.
The M1 series uses a scalable architecture. Each successive variant is based on the same underpinning technology. The M1 Pro increased the CPU and GPU core count. The M1 Max increased the GPU count yet further, added support for more unified memory and added additional media encoders. And the M1 Ultra pairs two M1 Max chips together. In each case, the 5nm technology and general architecture remained the same across the line.
If Apple does deviate with M2 Pro, it would make it far more difficult to predict future updates to Apple’s custom silicon.
iPhone 14 ready for assembly
In further reporting from Digitimes, components for the iPhone 14 line are shipping in volume to assembly partners. Components are reportedly arriving in bulk at Foxconn, Pegatron and other assembly partners. That’s unsurprising given that we’re likely around 2 and a half months from launch. Unless of course, Apple delays the launch due to the ongoing semiconductor crisis.